JPH0513011Y2 - - Google Patents

Info

Publication number
JPH0513011Y2
JPH0513011Y2 JP1987123180U JP12318087U JPH0513011Y2 JP H0513011 Y2 JPH0513011 Y2 JP H0513011Y2 JP 1987123180 U JP1987123180 U JP 1987123180U JP 12318087 U JP12318087 U JP 12318087U JP H0513011 Y2 JPH0513011 Y2 JP H0513011Y2
Authority
JP
Japan
Prior art keywords
circuit board
wire
semiconductor chip
bonding
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987123180U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6429885U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987123180U priority Critical patent/JPH0513011Y2/ja
Publication of JPS6429885U publication Critical patent/JPS6429885U/ja
Application granted granted Critical
Publication of JPH0513011Y2 publication Critical patent/JPH0513011Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP1987123180U 1987-08-13 1987-08-13 Expired - Lifetime JPH0513011Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987123180U JPH0513011Y2 (en]) 1987-08-13 1987-08-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987123180U JPH0513011Y2 (en]) 1987-08-13 1987-08-13

Publications (2)

Publication Number Publication Date
JPS6429885U JPS6429885U (en]) 1989-02-22
JPH0513011Y2 true JPH0513011Y2 (en]) 1993-04-06

Family

ID=31371794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987123180U Expired - Lifetime JPH0513011Y2 (en]) 1987-08-13 1987-08-13

Country Status (1)

Country Link
JP (1) JPH0513011Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629963U (en]) * 1979-08-15 1981-03-23
JPS58118739U (ja) * 1982-02-05 1983-08-13 富士電機株式会社 ボンデイングブロツク
JPS58151039A (ja) * 1982-03-04 1983-09-08 Denki Kagaku Kogyo Kk 混成集積回路基板

Also Published As

Publication number Publication date
JPS6429885U (en]) 1989-02-22

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